Alternative NSN: 5962-01-139-3210 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 011393210 |
NCB Code: USA (01) |
Manufacturers: Intersil Corporation , L 3 Services Inc , L 3 Communications Corporation , Philips Semiconductors Inc , National Semiconductor Corp , Mmi Amd , Freescale Semiconductor Inc , Dla Land And Maritime |
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
21676-00 | Intersil Corporation | microcircuit memory | Avl | RFQ |
21676-00 | L 3 Services Inc | microcircuit memory | Avl | RFQ |
21676-00 | L 3 Communications Corporation | microcircuit memory | Avl | RFQ |
21676-00 | Philips Semiconductors Inc | microcircuit memory | Avl | RFQ |
DM54S573J 883B | National Semiconductor Corp | microcircuit memory | Avl | RFQ |
HM1-7643-8 | Intersil Corporation | microcircuit memory | Avl | RFQ |
MM5353-1D-883B | Philips Semiconductors Inc | microcircuit memory | Avl | RFQ |
MM5353-1D-883B | Mmi Amd | microcircuit memory | Avl | RFQ |
MM5353D 883B | Mmi Amd | microcircuit memory | Avl | RFQ |
ROM-PROM-FAMILY-030 | L 3 Services Inc | microcircuit memory | Avl | RFQ |
ROM-PROM-FAMILY-030 | Freescale Semiconductor Inc | microcircuit memory | Avl | RFQ |
ROM/PROM FAMILY 030 | Dla Land And Maritime | microcircuit memory | Avl | RFQ |
S82S137F 883B | Philips Semiconductors Inc | microcircuit memory | Avl | RFQ |
S82S137I 883B | Philips Semiconductors Inc | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.302 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 532.48 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
5905-00-000-0136 (5905000000136) |
5905-00-001-2573 (5905000012573) |
5905-00-001-2812 (5905000012812) |
5905-00-001-2813 (5905000012813) |
5905-00-001-2814 (5905000012814) |
5905-00-001-2815 (5905000012815) |
5905-00-001-2818 (5905000012818) |
5905-00-001-2819 (5905000012819) |
5905-00-001-2821 (5905000012821) |
5905-00-001-2822 (5905000012822) |
5905-00-001-2826 (5905000012826) |
5905-00-001-2827 (5905000012827) |
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