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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-382-4648 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013824648 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | D | G | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 14.0 VOLTS MAXIMUM POWER SOURCE" |
CZER | MEMORY DEVICE TYPE | ROM" |
FEAT | SPECIAL FEATURES | 64 X 8 PROGRAMMED EPROM" |
PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD" |
PRMT | PRECIOUS MATERIAL | GOLD" |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT" |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS" |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED" |
CQSJ | INCLOSURE MATERIAL | CERAMIC" |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE" |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510" |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER" |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 14.0 VOLTS MAXIMUM POWER SOURCE" |
CZER | MEMORY DEVICE TYPE | ROM" |
FEAT | SPECIAL FEATURES | 64 X 8 PROGRAMMED EPROM" |
PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD" |
PRMT | PRECIOUS MATERIAL | GOLD" |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT" |
Guaranteed on-time |
|
Customized and |
|
Over 5100 |
|
Complete Purchasing |