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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-00-504-0210 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 005040210 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
1906-0024 | C | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.213 INCHES NOMINAL |
ABMK | OVERALL WIDTH | 0.320 INCHES NOMINAL |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
AXGY | MOUNTING METHOD | PRESS FIT |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 70.0 MAXIMUM REVERSE VOLTAGE,PEAK ALL SEMICONDUCTOR DEVICE DIODE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES FORWARD CURRENT,AVERAGE BLANK ALL SEMICONDUCTOR DEVICE DIODE AND 500.00 MILLIAMPERES PEAK FORWARD SURGE CURRENT NANOAMPERES ALL SEMICONDUCTOR DEVICE DIODE |
CTRD | POWER RATING PER CHARACTERISTIC | 225.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 135.0 DEG CELSIUS JUNCTION |
FEAT | SPECIAL FEATURES | COMMON ANODE; ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
TTQY | TERMINAL TYPE AND QUANTITY | 3 RIBBON |
Guaranteed on-time |
|
Customized and |
|
Over 5100 |
|
Complete Purchasing |